TECHNOLOGY
STRENGTH
SoC/IP
The SoC and IP engineering market is moving toward providing comprehensive solutions that address every stage of development, ensuring adaptability to specific needs.
At IDEAS2SILICON, we align with this trend by offering end-to-end solutions tailored to meet any requirement, ensuring flexibility, reliability, and seamless execution.
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Team IDEAS2SILICON
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LD/Verification
Ideas to specs to RTL design
and verification
Physical Design
DSM proven PD team + SoC platform = consistent and convergent SoC execution
DFT
Design for Test automated by experienced engineering team
FPGA
SoC prototyping and debugging enabled by industry standard FPGA platforms
Mixed Signals
Accomplished and seasoned analog design veterans for ultra-speed interfaces
Package & Board
Package and board designs and third-party vendor management
ATE
ATE vector generation and debugging
Operations
Managing major foundries, packaging, and test vendors
Complete SoC Solution
1.
IP/SoC Planning
- Architecture
- Specification
- IP Qualification & Selection
2.
Logic Design
- RTL Design
- FPGA Prototyping
- Logic Verification
- Static Timing Analysis
- Customized function design for IP
- FPGA design service
3.
DFT
- DFT Insertion - SCAN/BSCAN/MBIST
- DFT Verification
4.
Physical Design
- Logic Synthesis
- FloorPlan/PowerPlan
- Place & Route
- DRC/LVS/ANT/ERC
- Power/IR-Drop Analysis
- STA/SI Analysis, Sign-off
5.
Manufacturing
Service
- Foundry Management
- Package Design & Simulation & Assembly
- SI/PI Analysis
- Foundry/Supply Chain Management
- ATE setup & management
- Product Qualification
- Supply Chain management for MP
IP
Having a comprehensive portfolio of IPs in one place is essential for building stable and complete SoCs. IDEAS2SILICON offers a wide range of IPs compatible with various chip types, catering to diverse applications across numerous industries. Our IP solutions ensure reliability, interoperability, and seamless integration to meet the demands of the global market.
High Speed DDR IP
IDEAS2SILICON offers reliable high performance DDR Interface systems while at the same time using less power, area, latency, and cost. Markets include Data Centers, 5G, Mobile, ADAS, AI/ML, IoT, and Display Device. Supported IPs including: DDR3/4/5,LPDDR3/4/5, HBM*
Ultra Low Power
Best System Reliability & Yield
Highest Performance
Fastest
Time-to-Market
Lowest Latency
Lowest Cost
Smallest Area
High Speed SerDes IP
IDEAS2SILICON’s experienced and versatile team develops and delivers a broad range of high-speed serial interface standards. Our SerDes IP solutions ensure seamless integration, reliability, and performance across various applications and industries. Supported standards and configurations can be provided upon request.
- MIPI D/M-PHY, DSI/CSI/DigRF
- V-by-1 HS TX/RX
- HDMI TX/RX
- DP/eDP TX/RX
- Photonics 56G/32G
- USI-T/GF
- USB 3.0/2.0
- SDIO/ATA-SD
- 3G-SDI
Video Display IP
IDEAS2SILICON provides a wide array of hardware image enhancement algorithms, including:
- AI Enabled Super Resolution
- Image/Data Compression
- High Dynamic Range
- Color Engine
- Over Driving Circuit
- DeMura and Dither
- Local Dimming
Our advanced technology ensures high image quality with low implementation costs, addressing diverse requirements in video and display applications.
SoC/IP PLATFORM
Having a unified platform for SoC development and IP integration is key to creating efficient and reliable designs. IDEAS2SILICON’s Seraphim SoC/IP Platform offers advanced automation, seamless integration, and scalable collaboration, empowering teams to deliver high-quality SoCs faster while meeting the demands of today’s competitive markets.
SoC / IP Design Platform, SERAPHIM
Seraphim is a knowledge-based SoC/IP platform developed over many years to establish leadership and gain a competitive advantage in SoC services. It automates the physical design flow, enhances engineering capacity, addresses EDA tool limitations, enables QoR analysis automation, supports global team management, and streamlines resource training and scaling across design centers worldwide.
IDEAS2SILICON's state-of-the-art SoC/IP integration platform is designed to simplify SoC development and accelerate time-to-market. It provides a unified interface for seamless integration and configuration of IPs in complex SoC designs, ensuring efficiency and reliability.
Four-Manager System
Automation
Analysis Manager
All tool scripts automated
· All run environment automated · EDA deficiency addressed ·
Consistency & Organization
Data Manager
Same directory structure, tool scripts reports & logs,
file naming convention
Visibility
Monitor Manager
Anyone can check any engineer’s progress
· Real time web-interface · Managers have full visibility ·
Efficiency
Build Manager
Report & log analysis automated
· Engineer’s decision-making process enhanced ·
IP Integrator / SoC Composer, INTEGRON
The role of IP integration platforms is becoming increasingly vital as the percentage of IP in an SoC continues to grow. While a portion of SoC design involves IP block reuse, a robust integration platform is essential to reduce resource consumption, minimize errors, and shorten development time, ensuring efficient and reliable SoC design.
Stability
Performance
With IDEAS2SILICON's SoC/IP Platform
Area
Resource
Error
Cost
Risk
Time
Power
Seamless Integration Experience
• Offers an extensive collection of pre-verified, customizable IPs, ensuring flexibility for diverse project needs.
• Provides scalability to support various SoC designs, enabling efficient and reliable development processes.
• Delivers a comprehensive solution for reducing errors and development time, ensuring a seamless and productive integration experience.
REDUCTION
BRING-UP AND
CONFIGURATION
MANPOWER
ITERATION
CIRCLES
and Configuration
Cycles
PRODUCT
From AI edge computing and 5G/6G fronthaul to intelligent drone systems and silicon photonics, IDEAS2SILICON is building a portfolio of advanced silicon solutions — from AI edge processors to 5G fronthaul chips and intelligent drone imaging SoCs. Each solution reflects our proprietary IP and SoC engineering expertise, developed for scalable deployment and mass production.
Bethel AI SoC
IDEAS2SILICON's Bethel AI SoC is a next-generation edge AI processor built on patented Neural Net 2.0 architecture — delivering up to 20× area reduction, 20× lower power, and 10× cost efficiency versus conventional neural network implementations. Designed for TV, STB, mobile, automotive, and AR/VR applications, Bethel enables real-time 4K/8K content classification, object detection, and immersive cloud-connected viewing experiences at the silicon edge.
- CNN / RNN / FNN / GAN support
- Up to 104.9 TOPS (MAX variant)
- 7nm process technology
- HBM / LPDDR memory options
- AI content classification & overlay
- Cloud connectivity via AI engine
5G/6G SoC
IDEAS2SILICON's 5G/6G Fronthaul SoC implements the full O-RAN Split 7-2x architecture for 5G NR today — while integrating a forward-compatible 6G engine aligned with IMT-2030 requirements. From dynamic beamforming and IQ compression to AI-native network processing and sub-0.1ms latency, a single chip spans the full generational leap from today's 5G deployments to tomorrow's terahertz 6G infrastructure.
- O-RAN Split 7-2x (Cat-A & Cat-B)
- Dynamic BF · MIMO · RIS-ready
- IQ compression: BFP, μ-law
- 4G LTE + 5G NR dual-mode
- 6G IMT-2030 engine (THz-ready)
- Peak 1 Tbps / <0.1ms latency
- AI-native network processing
- 10G / 25G / 100G / 400G Ethernet
Drone SoC
IDEAS2SILICON's Drone SoC integrates the full imaging-and-communication pipeline on a single chip — combining gyro-based EIS, rolling shutter correction, and AI motion deblur with an embedded 5G modem for sub-millisecond command latency. Real-time 4K video is transmitted over 5G C2 links, enabling BVLOS operations, remote piloting, and swarm coordination that legacy Wi-Fi drones cannot match.
- EIS / DVS · Gyro sensor fusion
- Rolling Shutter Correction (RSC)
- AI-based Motion Deblur
- Image warp & scale engine
- 5G C2 link · <1ms latency
- BVLOS & swarm control ready
- 4K real-time 5G video stream
- Low-power integrated design
Photonics / Fiber IC
IDEAS2SILICON's 4-channel parallel optical transceiver IC built on Silicon Photonics — integrating laser diode driver, optical modulator, photo detector array, and TIA in a single 5×5mm package. Operating at up to 32 Gbps per channel (128 Gbps aggregate), it delivers lightspeed data transmission for data centers, 5G/6G fronthaul, and AI compute interconnects with ultra-low power consumption under 21 mW/Gbps.
- 4-ch TX + 4-ch RX integrated
- 32 Gbps × 4ch = 128 Gbps total
- <21 mW/Gbps (TX–RX pair)
- 5.0 × 5.0 mm compact package
- 1.3μm laser array · PD array
- MMF(OM3) up to 30m @ 32 Gbps
- I²C programmable control
- Data Center · 5G/6G · AI/HPC
